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  features description/ordering information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 available in the texas instruments nanostar? and nanofree? packages operates at 0.8 v to 2.7 v sub-1-v operable low power consumption, 10 m a at 2.7 v high on-off output voltage ratio high degree of linearity latch-up performance exceeds 100 ma per jesd 78, class ii esd protection exceeds jesd 22 ? 2000-v human-body model (a114-a) ? 200-v machine model (a115-a) ? 1000-v charged-device model (c101) this analog switch is operational at 0.8-v to 2.7-v v cc , but is designed specifically for 1.1-v to 2.7-v v cc operation. the sn74auc2g53 can handle both analog and digital signals. the device permits signals with amplitudes of up to v cc (peak) to be transmitted in either direction. nanostar? and nanofree? package technology is a major breakthrough in ic packaging concepts, using the die as the package. applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ordering information t a package (1) orderable part number top-side marking (2) nanostar? ? wcsp (dsbga) SN74AUC2G53YEPR 0.23-mm large bump ? yep tape and reel _ _ _u4_ nanofree? ? wcsp (dsbga) sn74auc2g53yzpr ?40c to 85c 0.23-mm large bump ? yzp (pb-free) ssop ? dct tape and reel sn74auc2g53dctr u53_ _ _ vssop ? dcu tape and reel sn74auc2g53dcur u53_ (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. (2) dct: the actual top-side marking has three additional characters that designate the year, month, and assembly/test site. dcu: the actual top-side marking has one additional character that designates the assembly/test site. yep/yzp: the actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. pin 1 identifier indicates solder-bump composition (1 = snpb, = pb-free). function table control on inputs channel inh a l l y1 l h y2 h x none please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. nanostar, nanofree are trademarks of texas instruments. production data information is current as of publication date. copyright ? 2003?2005, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www .ti.com dct or dcu p ackage (t op view) 12 3 4 87 6 5 com inh gndgnd v c c y1y2 a 43 2 1 56 7 8 gndgnd inh com ay2 y1 v c c yep or yzp p ackage (bott om view)
absolute maximum ratings (1) sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 logic diagram (positive logic) simplified schematic, each switch (sw) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range (2) ?0.5 3.6 v v i input voltage range (2) (3) ?0.5 3.6 v v i/o switch i/o voltage range (2) (3) ?0.5 v cc + 0.5 v i ik control input clamp current v i < 0 ?50 ma i i/ok i/o port diode current v i/o < 0 or v i/o > v cc 50 ma i t on-state switch current current v i/o = 0 to v cc 50 ma continuous current through v cc or gnd 100 ma dct package 220 q ja package thermal impedance (4) dcu package 227 c/w yep/yzp package 102 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to ground unless otherwise specified. (3) the input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (4) the package thermal impedance is calculated in accordance with jesd 51-7. 2 www .ti.com y2 a inh y1com 52 76 1 swsw note a: for simplicity , the test conditions shown in figures 1 through 4 and 6 through 10 are for the demultiplexer configuration. signals may be passed from com to y1 (y2) or from y1 (y2) to com. com y
recommended operating conditions (1) electrical characteristics sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 min max unit v cc supply voltage 0.8 2.7 v v cc = 0.8 v v cc v ih high-level input voltage v cc = 1.1 v to 1.95 v 0.65 v cc v v cc = 2.3 v to 2.7 v 1.7 v cc = 0.8 v 0 v il low-level input voltage v cc = 1.1 v to 1.95 v 0.35 v cc v v cc = 2.3 v to 2.7 v 0.7 v i/o i/o port voltage 0 v cc v v i control input voltage 0 3.6 v v cc = 0.8 v to 1.6 v 20 d t/ d v input transition rise or fall rate v cc = 1.65 v to 1.95 v 10 ns/v v cc = 2.3 v to 2.7 v 3.5 t a operating free-air temperature ?40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v cc min typ (1) max unit v i = v cc or gnd, 1.1 v 40 i s = 4 ma v inh = v il 1.65 v 12.5 20 r on on-state switch resistance w (see figure 1 and i s = 8 ma 2.3 v 6 15 figure 2 ) v i = v cc to gnd, 1.1 v 131 180 i s = 4 ma v inh = v il 1.65 v 32 80 r on(p) peak on resistance w (see figure 1 and i s = 8 ma 2.3 v 15 20 figure 2 ) v i = v cc to gnd, 1.1 v 4 i s = 4 ma difference of on-state resistance v c = v ih 1.65 v 1 d r on w between switches (see figure 1 and i s = 8 ma 2.3 v 1 figure 2 ) v i = v cc and v o = gnd, or 1 i s(off) off-state switch leakage current v i = gnd and v o = v cc , 2.7 v m a 0.1 (1) v inh = v ih (see figure 3 ) 1 v i = v cc or gnd, v inh = v il , i s(on) on-state switch leakage current 2.7 v m a v o = open (see figure 4 ) 0.1 (1) i i control input current v c = v cc or gnd 2.7 v 5 m a i cc supply current v c = v cc or gnd 2.7 v 10 m a c ic control input capacitance 2.5 v 2 pf y 3 c io(off) switch input/output capacitance 2.5 v pf com 4.5 c io(on) switch input/output capacitance 2.5 v 9 pf (1) t a = 25c 3 www .ti.com
switching characteristics switching characteristics analog switch characteristics sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 over recommended operating free-air temperature range, c l = 15 pf (unless otherwise noted) (see figure 5 ) v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v v cc = 0.8 v from to 0.1 v 0.1 v 0.15 v 0.2 v parameter unit (input) (output) typ min max min max min typ max min max t pd (1) com or y y or com 0.3 0.3 0.3 0.2 0.1 ns t en 9.2 0.5 3.5 0.5 2.2 0.5 1 1.9 0.5 1.8 inh com or y ns t dis 8.1 0.5 4.2 0.5 3.2 0.5 1.9 3.4 0.5 2.6 t en 9.2 0.5 3.6 0.5 2.3 0.5 1.1 1.9 0.5 1.6 a com or y ns t dis 10 0.5 3.6 0.5 2.3 0.5 1.1 2 0.5 1.6 (1) the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). over recommended operating free-air temperature range, c l = 30 pf (unless otherwise noted) (see figure 5 ) v cc = 1.8 v v cc = 2.5 v from to 0.15 v 0.2 v parameter unit (input) (output) min typ max min max t pd (1) com or y y or com 0.4 0.2 ns t en 0.5 1.6 3.1 0.5 2.2 inh com or y ns t dis 0.5 2.2 3.4 0.5 2.2 t en 0.5 1.6 3 0.5 2.2 a com or y ns t dis 0.5 1.6 3 0.5 2.3 (1) the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). t a = 25c from to parameter test conditions v cc typ unit (input) (output) 0.8 v 90 1.1 v 101 c l = 50 pf, r l = 600 w , f in = sine wave 1.4 v 110 (see figure 6 ) 1.65 v 122 2.3 v 198 frequency response (1) com or y y or com mhz (switch on) 0.8 v >500 1.1 v >500 c l = 5 pf, r l = 50 w , f in = sine wave 1.4 v >500 (see figure 6 ) 1.65 v >500 2.3 v >500 (1) adjust f in voltage to obtain 0 dbm at output. increase f in frequency until db meter reads ?3 db. 4 www .ti.com
operating characteristics sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 analog switch characteristics (continued) t a = 25c from to parameter test conditions v cc typ unit (input) (output) 0.8 v ?59 1.1 v ?59 c l = 50 pf, r l = 600 w , f in = 1 mhz (sine wave) 1.4 v ?59 (see figure 7 ) 1.65 v ?59 2.3 v ?60 crosstalk (2) com or y y or com db (between switches) 0.8 v ?55 1.1 v ?55 c l = 5 pf, r l = 50 w , f in = 1 mhz (sine wave) 1.4 v ?55 (see figure 7 ) 1.65 v ?55 2.3 v ?55 0.8 v 0.56 c l = 50 pf, r l = 600 w , 1.1 v 0.68 crosstalk f in = 1 mhz (square inh com or y 1.4 v 0.81 mv (control input to signal output) wave) 1.65 v 0.93 (see figure 8 ) 2.3 v 1.5 0.8 v ?60 1.1 v ?60 c l = 50 pf, r l = 600 w , f in = 1 mhz (sine wave) 1.4 v ?60 (see figure 9 ) 1.65 v ?60 2.3 v ?60 feed-through attenuation (2) com or y y or com db (switch off) 0.8 v ?59 1.1 v ?59 c l = 5 pf, r l = 600 w , f in = 1 mhz (sine wave) 1.4 v ?59 (see figure 9 ) 1.65 v ?59 2.3 v ?59 0.8 v 6.19 1.1 v 0.39 c l = 50 pf, r l = 10 k w , f in = 1 khz (sine wave) 1.4 v 0.06 (see figure 10 ) 1.65 v 0.02 2.3 v 0.01 sine-wave distortion com or y y or com % 0.8 v 3.55 1.1 v 0.38 c l = 50 pf, r l = 10 k w , f in = 10 khz (sine wave) 1.4 v 0.04 (see figure 10 ) 1.65 v 0.02 2.3 v 0.02 (2) adjust f in voltage to obtain 0 dbm at input. for inh input, t a = 25c v cc = 0.8 v v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v test parameter unit conditions typ typ typ typ typ power dissipation c pd f = 10 mhz 3 3 3 3 3 pf capacitance 5 www .ti.com
operating characteristics sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 for a input, t a = 25c v cc = 0.8 v v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v test parameter unit conditions typ typ typ typ typ outputs 5.5 5.5 5.5 5.5 5.5 power enabled c pd dissipation f = 10 mhz pf outputs capacitance 0.5 0.5 0.5 0.5 0.5 disabled 6 www .ti.com
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 1. on-state resistance test circuit figure 2. typical r on as a function of voltage (v i ) for v i = 0 to v cc 7 www .ti.com v c c v i = v c c or gnd v o r o n  v i  v o i s  v i - v o gnd v y1 i s (on) v c c v i l y2 av a v i n h inhcom v i l or v i h s1 2 v a v i l v i h s 12 0 20 40 60 80 100 120 0 1 2 3 v c c = 1.65 v v c c = 1.1 v v c c = 2.3 v
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 3. off-state switch leakage-current test circuit figure 4. on-state switch leakage-current test circuit 8 www .ti.com v c c v i v o gnd y1 (off) v c c v i h y2 av a v i n h inh com v i l or v i h s1 2 v a v i l v i h s 12 a condition 1: v i = gnd, v o = v c c condition 2: v i = v c c , v o = gnd v c c v i v o gnd y1 (on) v c c v i l y2 av a v i n h inhcom v i l or v i h s1 2 v a v i l v i h s 12 a v i = v c c or gnd v o = open
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 5. load circuit and voltage waveforms 9 www .ti.com v m t h t s u from output under t est c l (see note a) load circuit s1 v l o a d open gnd r l r l data input t iming input v i 0 vv i 0 v 0 v t w input vol t age w a veforms setup and hold times vol t age w a veforms prop aga tion dela y times inverting and noninverting outputs vol t age w a veforms pulse dura tion t p l h t p h l t p h l t p l h v o h v o h v o l v o l v i 0 v input output w aveform 1 s1 at v l o a d (see note b) output w aveform 2 s1 at gnd (see note b) v o l v o h t p z l t p z h t p l z t p h z v l o a d /2 0 v v o l + v d v o h ? v d 0 v v i vol t age w a veforms enable and disable times low - and high-level enabling outputoutput t p l h /t p h l t p l z /t p z l t p h z /t p z h open v l o a d gnd test s1 notes: a. c l includes probe and jig capacitance. b. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. w aveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 w , slew rate 1 v/ns . d. the outputs are measured one at a time, with one transition per measurement. e. t p l z and t p h z are the same as t d i s . f. t p z l and t p z h are the same as t e n . g. t p l h and t p h l are the same as t p d . h. all parameters and waveforms are not applicable to all devices. output control v m v m v m v m v m v m v m v m v m v m v m v m v i v m v m 0.8 v 1.2 v 0.1 v 1.5 v 0.1 v 1.8 v 0.15 v 2.5 v 0.2 v 1.8 v 0.15 v 2.5 v 0.2 v 2 k w 2 k w 2 k w 2 k w 2 k w 1 k w 500 w v c c r l 2 v c c 2 v c c 2 v c c 2 v c c 2 v c c 2 v c c 2 v c c v l o a d c l 15 pf15 pf 15 pf 15 pf 15 pf 30 pf 30 pf 0.1 v0.1 v 0.1 v 0.15 v0.15 v 0.15 v 0.15 v v d v c c v c c v c c v c c v c c v c c v c c v i v c c /2 v c c /2 v c c /2 v c c /2 v c c /2 v c c /2 v c c /2 v m t r /t f 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns inputs
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 6. frequency response (switch on) figure 7. crosstalk (between switches) 10 www .ti.com v c c v o gnd y1 (on) v c c v i l y2 av a v i n h inhcom v i l or v i h s1 2 v a v i l v i h s 12 50 w 0.1 m f f i n r l /c l : 600 w /50 pf r l /c l : 50 w /5 pf r l c l v c c /2 v c c v o 1 gnd y1 v c c v i l y2 v i l or v i h 50 w 0.1 m f f i n c l 50 pf v c c /2 r i n 600 w r l 600 w v o 2 c l 50 pf v c c /2 r l 600 w v a v i l v i h test condition 20log 1 0 (v o 2 /v i ) 20log 1 0 (v o 1 /v i ) av a v i n h inhcom
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 8. crosstalk (control input, switch output) figure 9. feedthrough (switch off) 11 www .ti.com v c c v o gnd y1 (on) v c c y2 v i l or v i h s1 2 v a v i l v i h s 12 50 w v c c /2 r i n 600 w v c c /2 c l 50 pf r l 600 w av a v i n h inh com v c c v o gnd y1 (off) v c c v i l y2 v i l or v i h s 12 50 w 0.1 m f f i n r l /c l : 600 w /50 pf r l /c l : 50 w /5 pf r l c l v c c /2 r l v c c /2 av a v i n h inh com s1 2 v a v i l v i h
parameter measurement information sn74auc2g53 single-pole double-throw (spdt) analog switch or 2:1 analog multiplexer/demultiplexer sces484a ? august 2003 ? revised march 2005 figure 10. sine-wave distortion 12 www .ti.com v c c v o gnd y1 (on) v c c v i l y2 v i l or v i h s1 2 v a v i l v i h s 12 600 w 10 m f f i n r l 10 k w c l 50 pf v c c /2 10 m f av a v i n h inh com v c c = 0.8 v , v i = 0.7 v p - p v c c = 1.1 v , v i = 1 v p - p v c c = 1.4 v , v i = 1.2 v p - p v c c = 1.65 v , v i = 1.4 v p - p v c c = 2.3 v , v i = 2 v p - p
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74auc2g53dctr active sm8 dct 8 3000 pb-free (rohs) cu nipdau level-1-260c-unlim sn74auc2g53dctre4 active sm8 dct 8 3000 pb-free (rohs) cu nipdau level-1-260c-unlim sn74auc2g53dcur active us8 dcu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g53dcure4 active us8 dcu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g53dcurg4 active us8 dcu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74AUC2G53YEPR nrnd wcsp yep 8 3000 tbd snpb level-1-260c-unlim sn74auc2g53yzpr active wcsp yzp 8 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 7-dec-2006 addendum-page 1
mechanical data mpds049b ? may 1999 ? revised october 2002 post office box 655303 ? dallas, texas 75265 dct (r-pdso-g8) plastic small-outline package ????? ????? ????? ????? 0,60 0,20 0,25 0 ? 8 0,15 nom gage plane 4188781/c 09/02 4,25 5 0,30 0,15 2,90 3,75 2,70 8 4 3,15 2,75 1 0,10 0,00 1,30 max seating plane 0,10 m 0,13 0,65 pin 1 index area notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion d. falls within jedec mo-187 variation da.



important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated


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